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Information on didactic, research and institutional assignments on this page are certified by the University; more information, prepared by the professor, are available on the personal web page and in the curriculum vitae indicated on this webpage.
Information on professor
ProfessorCodecasa Lorenzo
QualificationAssociate professor full time
Belonging DepartmentDipartimento di Elettronica, Informazione e Bioingegneria
Scientific-Disciplinary SectorING-IND/31 - Electrical Engineering
Curriculum Vitae--
OrcIDhttps://orcid.org/0000-0002-2851-3698

Contacts
Professor's office hours
DepartmentFloorOfficeDayTimetableTelephoneFaxNotes
Elettronica e Informazione--416MondayFrom 17:15
To 18:15
0223993534----
E-maillorenzo.codecasa@polimi.it
Professor's personal websiteftp://ftp.elet.polimi.it/outgoing/Lorenzo.Codecasa

Data source: RE.PUBLIC@POLIMI - Research Publications at Politecnico di Milano

List of publications and reserach products for the year 2021 (Show all details | Hide all details)
Type Title of the Publicaiton/Product
Journal Articles
Exact conic section arc elements in 2D and 2.5D FEM using a coordinate transformation (Show >>)


List of publications and reserach products for the year 2020 (Show all details | Hide all details)
Type Title of the Publicaiton/Product
Abstract in Atti di convegno
An h- Cell-Method Formulation for Solving Eddy-Current Problems in Multiply-Connected Domains Without Cuts (Show >>)
Contributions on scientific books
An approach to the cell-level diagnosis of malfunctioning events in PV panels from aerial thermal maps (Show >>)
Conference proceedings
Altering MOR-Based BCI CTMs into Delphi-Like BCI CTMs (Show >>)
Thermal modeling of BGA package families using the Thermal Resistance and Impedance Calculator (TRIC) (Show >>)
Journal Articles
A Novel h-φ approach for solving eddy-current problems in multiply connected regions (Show >>)
Circuit-based electrothermal simulation of multicellular sic power MOSFETs using FANTASTIC (Show >>)
Domain Decomposition with Non-Conforming Polyhedral Grids (Show >>)
Enforcing Lumped Parameter Excitations in Edge-Element Formulations by Using a Fast Iterative Approach (Show >>)
Exploiting Port Responses for Wideband Analysis of Multimode Lossless Devices (Show >>)
TRIC: A thermal resistance and impedance calculator for electronic packages (Show >>)
The Time-Domain Cell Method Is a Coupling of Two Explicit Discontinuous Galerkin Schemes with Continuous Fluxes (Show >>)
Uncertainty Quantification for SAE J2954 Compliant Static Wireless Charge Components (Show >>)


List of publications and reserach products for the year 2019 (Show all details | Hide all details)
Type Title of the Publicaiton/Product
Conference proceedings
Algorithm for Establishing the Dependence of Structure Functions on Spatial Distributions of Thermal Properties (Show >>)
An efficient simulation methodology to quantify the impact of parameter fluctuations on the electrothermal behavior of multichip sic power modules (Show >>)
Experimental Assessment of Malfunction Events in Photovoltaic Modules from IR Thermal Maps (Show >>)
Practical thermal modeling of planar magnetic component devices (Show >>)
Thermal Resistance and Impedance Calculator (TRIC) (Show >>)
Three-Steps Approach to Uncertainty Quantification for Electronic Components and Packages (Show >>)
Scientific Books
Model-order reduction procedure for fast dynamic electrothermal simulation of power converters (Show >>)
Thermal and Electro-thermal System Simulation (Show >>)
Journal Articles
A 3-D Hybrid Cell Boundary Element Method for Time-Harmonic Eddy Current Problems on Multiply Connected Domains (Show >>)
A face-smoothed cell method for static and dynamic piezoelectric coupled problems on polyhedral meshes (Show >>)
A-Priori Error Bound for Moment Matching Approximants of Thermal Models (Show >>)
Accurate and efficient analysis of the upward heat flow in InGaP/GaAs HBTs through an automated FEM-based tool and Design of Experiments (Show >>)
Dynamic electro-thermal modeling of solar cells and modules (Show >>)
Fast Uncertainty Quantification in Low Frequency Electromagnetic Problems by an Integral Equation Method Based on Hierarchical Matrix Compression (Show >>)
Shooting by a Two-Step Galerkin Method (Show >>)
Stochastic PEEC Method Based on Polynomial Chaos Expansion (Show >>)
TRAC: A thermal resistance advanced calculator for electronic packages (Show >>)


List of publications and reserach products for the year 2018 (Show all details | Hide all details)
Type Title of the Publicaiton/Product
Conference proceedings
Combined SPICE-FEM analysis of electrothermal effects in InGaP/GaAs HBT devices and arrays for handset applications (Show >>)
E-Plane Metal-Insert Filters with Pseudo-Elliptic Response (Show >>)
Experimental Characterization of MOR-based and Delphi-like BCI DCTMs (Show >>)
Modeling Thermal Coupling in Bipolar Power Amplifiers toward Dynamic Electrothermal Simulation (Show >>)
Novel Approach to the Extraction of Delphi-like Boundary-Condition-Independent Compact Thermal Models of Planar Transformer Devices (Show >>)
On the Benefit of Adopting Saturable Inductors in Switching-Mode Power-Supplies: A Case Study (Show >>)
Thermal Resistance Advanced Calculator (TRAC) (Show >>)
Journal Articles
GPU Accelerated Time-Domain Discrete Geometric Approach Method for Maxwell's Equations on Tetrahedral Grids (Show >>)
Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization (Show >>)
Novel FDTD technique over tetrahedral grids for conductive media (Show >>)
On the performance of piezoelectric harvesters loaded by finite width impulses (Show >>)
To the special issue constructed from the selected papers of Thermal investigations of integrated circuits and systems, THERMINIC’17 (Show >>)
Versatile MOR-based boundary condition independent compact thermal models with multiple heat sources (Show >>)


List of publications and reserach products for the year 2017 (Show all details | Hide all details)
Type Title of the Publicaiton/Product
Contributions on scientific books
MOR-based uncertainty quantification in transcranial magnetic stimulation (Show >>)
Conference proceedings
Connecting MOR-based boundary condition independent compact thermal models (Show >>)
Delphi-like Dynamical Compact Thermal Models using Model Order Reduction (Show >>)
Influence of layout and technology parameters on the thermal behavior of InGaP/GaAs HBTs (Show >>)
Model order reduction approach to uncertainty quantification in eddy current problems (Show >>)
Novel approach for the extraction of nonlinear compact thermal models (Show >>)
Numerical Analysis of the Thermal Behavior Sensitivity to Technology Parameters and Operating Conditions in InGaP/GaAs HBTs (Show >>)
Uncertainty quantification in transcranial magnetic stimulation with correlation between tissue conductivities (Show >>)
Wideband analysis of lossless multimode waveguide junctions (Show >>)
Journal Articles
3-D thermal models calibration by parametric dynamic compact thermal models (Show >>)
A 3-D Hybrid Cell Method for Induction Heating Problems (Show >>)
A Geometric Frequency-Domain Wave Propagation Formulation for Fast Convergence of Iterative Solvers (Show >>)
Fast Nonlinear Dynamic Compact Thermal Modeling with Multiple Heat Sources in Ultra-Thin Chip Stacking Technology (Show >>)
MOR-based approach to uncertainty quantification in electrokinetics with correlated random material parameters (Show >>)
Nonlinear model order reduction for the fast solution of induction heating problems in time-domain (Show >>)
On-line junction temperature monitoring of switching devices with dynamic compact thermal models extracted with model order reduction (Show >>)
Partition-based approach to parametric dynamic compact thermal modeling (Show >>)
Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies (Show >>)
Stochastic finite integration technique for magnetostatic problems (Show >>)
Uncertainty quantification in linear magnetostatic problems with correlated random reluctivities (Show >>)
manifesti v. 3.4.11 / 3.4.11
Area Servizi ICT
24/06/2021